China’s storage makers aim to climb value chain with advanced packaging bets

Chinese storage makers, long known for packaging chips into modules, have been moving up the value chain into wafer-level operations, with the latest firm to make the jump investing 4.

5 billion yuan (US$672 million) in an advanced packaging project. The sum, which Shanghai-listed Biwin Storage Technology will pour into the third phase of its advanced packaging and testing project in Dongguan, in southern China’s…